DNZ PRODUCTS REM 700‑LA‑HIGH SIL 13700UPC: 879956000057Premium High‑Silicon Wafer for Cutting‑Edge ApplicationsThe DNZ PRODUCTS REM 700‑LA‑HIGH SIL 13700 is a top‑grade silicon wafer engineered for the most demanding semiconductor processes. With a precise thickness of 13.7 µm and a high‑purity silicon composition, this wafer delivers exceptional electrical performance, superior mechanical stability, and outstanding thermal conductivity—key attributes for modern microelectronics, MEMS, and photovoltaic devices.Key BenefitsUltra‑high silicon purity for reduced defect densityConsistent thickness tolerance ensures uniform device performanceOptimized crystal orientation for enhanced carrier mobilityLow surface roughness for superior lithography resultsRobust mechanical strength reduces breakage during handlingTechnical SpecificationsSpecificationDetailModelREM 700‑LA‑HIGH SIL 13700ManufacturerDNZ PRODUCTSWafer Thickness13.7 µm ± 0.5 µmDiameter200 mm (8 inches)Crystal Orientation(100) ± 0.5°Resistivity0.1–10 Ω·cm (customizable)Surface FinishMirror‑polished, RMS ≤ 0.5 nmPackagingESD‑protected wafer cassette (25 wafers per cassette)ComplianceISO 9001, RoHS, REACHWhy Choose DNZ PRODUCTS?DNZ PRODUCTS has a proven track record of delivering high‑quality silicon wafers that meet the rigorous standards of today’s semiconductor manufacturers. Our state‑of‑the‑art crystal growth facilities and strict quality‑control protocols guarantee that every REM 700‑LA‑HIGH SIL wafer provides consistent performance, minimizing yield loss and maximizing production efficiency.ApplicationsAdvanced CMOS and FinFET transistorsPower electronics and high‑voltage devicesMEMS sensors and actuatorsSolar cell substrates and photovoltaic modulesIntegrated photonics and optical componentsOrdering InformationTo place an order for the DNZ PRODUCTS REM 700‑LA‑HIGH SIL 13700, reference the UPC 879956000057 and specify the desired quantity, wafer orientation, and any custom resistivity requirements. Our dedicated sales team will provide a quotation and lead‑time estimate based on your specifications.