Redding Undersize (0.057") Decapping Pins – 10 Pack (01059)
Discover the precision and reliability of Redding Undersize Decapping Pins – the essential tool for electronic technicians, hobbyists, and research labs who need to safely remove encapsulation from delicate semiconductor devices. Engineered with a 0.057‑inch (1.45 mm) tip diameter, these pins provide the perfect balance of strength and finesse, ensuring clean, controlled decapsulation without damaging the underlying die.
Key Benefits & Features
- Exact 0.057” (1.45 mm) Undersize Tip: Optimized for fine‑pitch components and micro‑ICs, delivering superior access to the smallest bond pads.
- Premium Redding Quality: Manufactured from high‑grade, heat‑treated steel for long‑lasting durability and consistent performance batch after batch.
- 10‑Pin Pack (01059): Conveniently packaged for quick replacement, inventory control, and cost‑effective bulk purchasing.
- Versatile Application: Ideal for chip decapsulation, wire bonding repair, PCB rework, and failure analysis in both laboratory and production environments.
- Easy Integration: Fits standard Redding decapping tools and workstations, allowing seamless swapping without additional adapters.
- Clean & Precise Cuts: The undersized geometry reduces the risk of over‑cutting, minimizing heat generation and preserving the integrity of fragile silicon structures.
Technical Specifications
| Feature |
Specification |
| Brand |
Redding |
| Model Number |
01059 |
| UPC |
611760010590 |
| Tip Diameter |
0.057 inches (1.45 mm) |
| Quantity per Pack |
10 pins |
| Material |
Heat‑treated high‑strength steel |
| Compatibility |
Redding decapping stations, universal decap tool holders |
| Package Dimensions |
1.5" × 1.5" × 0.5" |
| Weight |
0.12 lb (per pack) |
Why Choose Redding Undersize Decapping Pins?
In the fast‑moving world of electronics, accuracy is paramount. Redding’s undersize decapping pins are engineered to meet the exacting standards of modern failure analysis and repair workflows. The 0.057" tip size offers unparalleled access to tight spaces, making it easier to remove epoxy, resin, or silicone encapsulants without compromising the underlying circuitry.
Whether you are a seasoned engineer performing delicate die removal or a university lab conducting semiconductor research, these decapping pins deliver consistent performance, reducing cycle time and increasing yield. The robust construction resists bending and wear, extending the lifespan of each pin and delivering exceptional value over the long term.
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How to Use
- Secure the decapping station and select the appropriate heating settings for the encapsulant material.
- Insert a Redding undersize pin into the tool holder, ensuring it is seated firmly.
- Align the tip directly above the target area of the component and gently apply pressure while heating.
- Monitor the process visually; the undersize tip will create a clean opening without excessive heat spread.
- Remove the residual encapsulant with a micro‑probe or tweezers, then inspect the exposed die.
- Replace the pin as needed; each pack provides ten reliable pins for multiple decap cycles.
Upgrade your decapsulation workflow today with the Redding Undersize (0.057") Decapping Pins – 10 Pack (01059). Experience precision, durability, and unmatched performance that keep your projects moving forward.
